Packaging Director - Asia - Texas Instruments - Shanghai

Job description
Texas Instruments (TI) is out front and ready for the next big challenge. Our innovations are at the core of nearly every electronics product in use today. And it doesn’t stop there. We’re developing breakthrough technology to power the world’s future innovations as well. TI is committed to building a better future — from the responsible manufacturing of our semiconductors, to caring for our employees, to giving back inside our communities. Put your talent to work with us.



Packaging is a key enabling technology powering Texas Instruments semiconductor leadership. As a result, this Packaging Director will have unique ownership of programs to introduce industry-leading packaging solutions from concept through to mass production. TI is on the leading edge of many new packaging technologies, and there is huge scope for innovation and job satisfaction associated with the breadth of responsibility in this role.

In this role, you will work with US, Europe and Asia colleagues and customers in multiple time zones. Some international travel will be required. Specific responsibilities include:
• Managing new product programs from inception to mass production, and/or managing new development programs from inception to mass production.
• Leading a team responsible for the development, qualification, and ramp to volume of fundamentally new wafer processing and package assembly materials, equipment, and processes (examples: FC QFNs, FET packaging).
• Leading a team responsible for the expansion of Asia factory capabilities involving the development, qualification, and ramp to volume of derivative wafer processing and packaging technologies (examples: WB packaging , FC packaging, Copper Pillar, 300mm WCSP, 300mm BOAC).
• Collaborating with Texas Instruments technology procurement infrastructure on supplier logistics, development, logistics and other packaging supply chain issues.
• Aligning worldwide development and manufacturing strategies.
• Ensuring best practices are shared with other manufacturing sites from a quality, yield, productivity, and cost perspective.
• Supporting operations with cost reduction and yield enhancement activities.
• Enhancing the overall technical talent level in TI Asia Packaging through people development and promotion of TI’s technical achievements in packaging throughout Asia with participation in International forums, conferences and publications.

The ideal candidate will have a Master’s degree in Electrical Engineering or an Engineering related degree. 10 years of semiconductor experience is needed.

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